Ve311 Lab #2 -Solved

1. [Common-Emitter Amplifier]  
(a) Design and build a common-emitter amplifier in Proteus and on the breadboard which has a voltage gain Aυ > 10, using npn BJT 2N3904. Plot VOUT vs VIN. (Hint: First choose an appropriate RC. Second, perform DC sweep to find out a VIN at which the magnitude of slope is more than 10. At the same time, make sure the BJT is in the forward-active region. If not working, change for another RC and repeat the DC sweep analysis again.) 

(b)  For Vin = VIN + 0.01sin(2π102 ∙ time), plot Vout = VOUT +  υout vs time. Confirm that the amplitude of υout is equal to 0.01 ×

Aυ. 

(c)For Vin = VIN + 0.01sin(2π107 ∙ time), plot Vout = VOUT +
 υout vs time. Is the amplitude of υout still equal to 0.01 × Aυ? If not, explain the possible reasons. 

2N3903, 2N3904

General Purpose Transistors

NPN Silicon

Features

• Pb−Free Packages are Available*

MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
VCEO
40
Vdc
Collector−Base Voltage
VCBO
60
Vdc
Emitter−Base Voltage
VEBO
6.0
Vdc
Collector Current − Continuous
IC
200
mAdc
Total Device Dissipation @ TA = 25°C

Derate above 25°C
PD
625

5.0
mW

mW/°C
Total Device Dissipation

@ TC = 25°C

Derate above 25°C
PD
1.5 12
W

mW/°C
Operating and Storage Junction Temperature Range
TJ, Tstg
−55 to +150
°C
THERMAL CHARACTERISTICS (Note 1)
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
RJA
200
°C/W
Thermal Resistance, Junction−to−Case
RJC
83.3
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. Indicates Data in addition to JEDEC Requirements.

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
 
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AMMO PACK
Y      = Year

WW = Work Week
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(Note: Microdot may be in either location)

ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.

© Semiconductor Components Industries, LLC, 2012                                                                    1                                                                  Publication Order Number:
August, 2012 − Rev. 8            2N3903/D ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS

Collector−Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0)
V(BR)CEO
40
−
Vdc
Collector−Base Breakdown Voltage (IC = 10 Adc, IE = 0)
V(BR)CBO
60
−
Vdc
Emitter−Base Breakdown Voltage (IE = 10 Adc, IC = 0)
V(BR)EBO
6.0
−
Vdc
Base Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc)
IBL
−
50
nAdc
Collector Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc)
ICEX
−
50
nAdc
ON CHARACTERISTICS

DC Current Gain (Note 2)

(IC = 0.1 mAdc, VCE = 1.0 Vdc)

(IC = 1.0 mAdc, VCE = 1.0 Vdc)

(IC = 10 mAdc, VCE = 1.0 Vdc)

(IC = 50 mAdc, VCE = 1.0 Vdc)

(IC = 100 mAdc, VCE = 1.0 Vdc)
2N3903

2N3904

2N3903

2N3904

2N3903

2N3904

2N3903

2N3904

2N3903 2N3904
hFE
20

40

35

70

50

100

30

60

15

30
−
− 150

300

−
Collector−Emitter Saturation Voltage (Note 2)

(IC = 10 mAdc, IB = 1.0 mAdc)

(IC = 50 mAdc, IB = 5.0 mAdc
 
VCE(sat)
−

−
0.2

0.3
Vdc
Base−Emitter Saturation Voltage (Note 2)

(IC = 10 mAdc, IB = 1.0 mAdc)

(IC = 50 mAdc, IB = 5.0 mAdc)
 
VBE(sat)
0.65 −
0.85

0.95
Vdc
SMALL−SIGNAL CHARACTERISTICS

Current−Gain − Bandwidth Product

(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
2N3903

2N3904
fT
250

300
−

−
MHz
Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
 
Cobo
−
4.0
pF
Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
 
Cibo
−
8.0
pF
Input Impedance

(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903

2N3904
hie
1.0

1.0
8.0 10
k 
Voltage Feedback Ratio

(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903

2N3904
hre
0.1

0.5
5.0

8.0
X 10−4
Small−Signal Current Gain

(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903

2N3904
hfe
50

100
200

400
−
Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
 
hoe
1.0
40
mhos
Noise Figure

(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k , f = 1.0 kHz)
2N3903

2N3904
NF
−

−
6.0

5.0
dB
SWITCHING CHARACTERISTICS

Delay Time
(VCC = 3.0 Vdc, VBE = 0.5 Vdc,

IC = 10 mAdc, IB1 = 1.0 mAdc)
 
td
−
35
ns
Rise Time
tr
−
35
ns
Storage Time
(VCC = 3.0 Vdc, IC = 10 mAdc,

IB1 = IB2 = 1.0 mAdc)
2N3903 2N3904
ts
−

−
175

200
ns
Fall Time
tf
−
50
ns
2. Pulse Test: Pulse Width  300 s; Duty Cycle  2%.

ORDERING INFORMATION
Device
Package
Shipping†
2N3903RLRM
TO−92
2000 / Ammo Pack
2N3904
TO−92
5000 Units / Bulk
2N3904G
TO−92

(Pb−Free)
5000 Units / Bulk
2N3904RLRA
TO−92
2000 / Tape & Reel
2N3904RLRAG
TO−92

(Pb−Free)
2000 / Tape & Reel
2N3904RLRM
TO−92
2000 / Ammo Pack
2N3904RLRMG
TO−92

(Pb−Free)
2000 / Ammo Pack
2N3904RLRP
TO−92
2000 / Ammo Pack
2N3904RLRPG
TO−92

(Pb−Free)
2000 / Ammo Pack
2N3904RL1G
TO−92

(Pb−Free)
2000 / Tape & Reel
2N3904ZL1
TO−92
2000 / Ammo Pack
2N3904ZL1G
TO−92

(Pb−Free)
2000 / Ammo Pack
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

 300 ns

Figure 1. Delay and Rise Time Equivalent Test Circuit
 

Figure 2. Storage and Fall Time Equivalent Test Circuit

TYPICAL TRANSIENT CHARACTERISTICS
 

 5 5

           1.0       2.0  3.0    5.0 7.0 10        20   30     50 70 100      200                1.0       2.0  3.0    5.0 7.0 10        20   30     50 70 100       200

                               IC, COLLECTOR CURRENT (mA)                                                         IC, COLLECTOR CURRENT (mA)

                                    Figure 5. Turn−On Time                                                                       Figure 6. Rise Time
 

                                     Figure 7. Storage Time                                                                         Figure 8. Fall Time

TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS NOISE FIGURE VARIATIONS
 

0                                                                                                                0

         0.1    0.2    0.4       1.0    2.0    4.0       10     20     40       100                  0.1    0.2    0.4       1.0    2.0     4.0       10     20     40       100

                                       f, FREQUENCY (kHz)                                                                 RS, SOURCE RESISTANCE (k OHMS)

                                                Figure 9.                                                                                                Figure 10. 

h PARAMETERS
 

       30                                                                                                              1

           0.1        0.2   0.3     0.5         1.0         2.0   3.0     5.0         10                  0.1        0.2   0.3     0.5         1.0         2.0  3.0     5.0         10

IC, COLLECTOR CURRENT (mA) Figure 11. Current Gain
IC, COLLECTOR CURRENT (mA) Figure 12. Output Admittance
 

IC, COLLECTOR CURRENT (mA) Figure 13. Input Impedance
IC, COLLECTOR CURRENT (mA) Figure 14. Voltage Feedback Ratio
TYPICAL STATIC CHARACTERISTICS
 

IC, COLLECTOR CURRENT (mA)

Figure 15. DC Current Gain
 

IB, BASE CURRENT (mA)

Figure 16. Collector Saturation Region
 

        0                                                                                                           -2.0

          1.0       2.0          5.0       10       20            50       100      200                   0      20     40     60     80    100   120   140    160   180  200

IC, COLLECTOR CURRENT (mA) Figure 17. “ON” Voltages

IC, COLLECTOR CURRENT (mA) Figure 18. Temperature Coefficients

 
       3                               3

STRAIGHT LEAD    BENT LEAD
 T

STRAIGHT LEAD
1.

2. 3.

4.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1994.

CONTROLLING DIMENSION: INCHES.

CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.

DIMENSION F APPLIES BETWEEN DIMENSIONS P

AND L. DIMENSIONS D AND J APPLY BETWEEN DI­

MENSIONS L AND K MINIMUM. THE LEAD

DIMENSIONS ARE UNCONTROLLED IN DIMENSION P AND BEYOND DIMENSION K MINIMUM.
NOTES:

DIM
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.175
0.205
4.44
5.21
B
0.290
0.310
7.37
7.87
C
0.125
0.165
3.18
4.19
D
0.018
0.021
0.46
0.53
F
0.016
0.019
0.41
0.48
G
0.045
0.055
1.15
1.39
H
0.095
0.105
2.42
2.66
J
0.018
0.024
0.46
0.61
K
0.500
---
12.70
---
L
0.250
---
6.35
---
N
0.080
0.105
2.04
2.66
P
---
0.100
---
2.54
R
0.135
---
3.43
---
V
0.135
---
3.43
---
 
NOTES:
BENT LEAD
1.

2. 3.

4.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

CONTROLLING DIMENSION: INCHES.

CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.

DIMENSION F APPLIES BETWEEN DIMENSIONS P

AND L. DIMENSIONS D AND J APPLY BETWEEN

DIMENSIONS L AND K MINIMUM. THE LEAD DIMENSIONS ARE UNCONTROLLED IN DIMENSION P AND BEYOND DIMENSION K MINIMUM.
 SECTION X−X

DIM
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.175
0.205
4.44
5.21
B
0.290
0.310
7.37
7.87
C
0.125
0.165
3.18
4.19
D
0.018
0.021
0.46
0.53
G
0.094
0.102
2.40
2.80
J
0.018
0.024
0.46
0.61
K
0.500
---
12.70
---
N
0.080
0.105
2.04
2.66
P
---
0.100
---
2.54
R
0.135
---
3.43
---
V
0.135
---
3.43
---
 SECTION X−X

STYLES ON PAGE 2
DOCUMENT NUMBER:
98AON52857E
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.
DESCRIPTION:
TO−92 (TO−226) 1 WATT
 
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© Semiconductor Components Industries, LLC, 2019                                                                                                                                                                                          www.onsemi.com

STYLE 1:

   PIN 1. EMITTER

2.  BASE

3.  COLLECTOR

STYLE 6:

   PIN 1.  GATE

2.  SOURCE & SUBSTRATE

3.  DRAIN

STYLE 11:

   PIN 1.  ANODE

2.  CATHODE & ANODE

3.  CATHODE

STYLE 16:

   PIN 1.  ANODE

2.  GATE

3.  CATHODE

STYLE 21:

   PIN 1. COLLECTOR

2.  EMITTER

3.  BASE

STYLE 26:

   PIN 1.  VCC

2.  GROUND 2

3.  OUTPUT

STYLE 31:

   PIN 1.  GATE

2.  DRAIN

3.  SOURCE

STYLE 2:
 
PIN 1.
BASE
2.
EMITTER
3. STYLE 7:
COLLECTOR
PIN 1.
SOURCE
2.
DRAIN
3.
GATE
STYLE 12:

PIN 1. MAIN TERMINAL 1 2. GATE

       3. MAIN TERMINAL 2

STYLE 17:

   PIN 1. COLLECTOR

2.  BASE

3.  EMITTER

STYLE 22:

   PIN 1. SOURCE

2.  GATE

3.  DRAIN

STYLE 27:

   PIN 1.  MT

2.  SUBSTRATE

3.  MT

STYLE 32:

   PIN 1.  BASE

2.  COLLECTOR

3.  EMITTER

STYLE 3:
 
PIN 1.
ANODE
2.
ANODE
STYLE 8:
CATHODE
PIN 1.
DRAIN
2.
GATE
3.
SOURCE & SUBSTRATE
CASE 29−10 ISSUE A
STYLE 13:

   PIN 1.  ANODE 1

2.  GATE

3.  CATHODE 2

STYLE 18:


   PIN 1.  ANODE

2.  CATHODE

3.  NOT CONNECTED

STYLE 23:

   PIN 1.  GATE

2.  SOURCE

3.  DRAIN

STYLE 28:

   PIN 1. CATHODE

2.  ANODE

3.  GATE

STYLE 33:

   PIN 1. RETURN

2.  INPUT

3.  OUTPUT

STYLE 4:
 
PIN 1.
CATHODE
2.
CATHODE
3. STYLE 9:
ANODE
PIN 1.
BASE 1
2.
EMITTER
3.
BASE 2
STYLE 14:

   PIN 1. EMITTER

2.  COLLECTOR

3.  BASE

STYLE 19:

   PIN 1.  GATE

2.  ANODE

3.  CATHODE

STYLE 24:

   PIN 1. EMITTER

2.  COLLECTOR/ANODE

3.  CATHODE

STYLE 29:

   PIN 1. NOT CONNECTED

2.  ANODE

3.  CATHODE

STYLE 34:

   PIN 1.  INPUT

2.  GROUND

3.  LOGIC

DATE 08 MAY 2012
STYLE 5:

   PIN 1.  DRAIN

2.  SOURCE

3.  GATE

STYLE 10:

   PIN 1. CATHODE

2.  GATE

3.  ANODE

STYLE 15:

   PIN 1.  ANODE 1

2.  CATHODE

3.  ANODE 2

STYLE 20:

   PIN 1. NOT CONNECTED

2.  CATHODE

3.  ANODE

STYLE 25:

   PIN 1.  MT 1

2.  GATE

3.  MT 2

STYLE 30:

   PIN 1.  DRAIN

2.  GATE

3.  SOURCE

STYLE 35:

   PIN 1.  GATE

2.  COLLECTOR

3.  EMITTER

TO−92 (TO−226) 1 WATT

DOCUMENT NUMBER:
98AON52857E
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.
DESCRIPTION:
TO−92 (TO−226) 1 WATT
 
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